We are grateful to the following sponsors for funding and collaboration:

• Air Force Office of Research (AFOSR)
• Analog Devices, Inc.
• Defense Advanced Research Projects Agency (DARPA)
• Department of Energy (DOE)
• Deshpande Center for Technological Innovation
• Lincoln Laboratory
• National Renewable Energy Laboratory (NREL)
• National Science Foundation (NSF)
• National Science Foundation Industry University Cooperative Research Program (NSF-I/UCR) for Silicon Wafer Engineering and Defect Science Center (SiWEDS)
• National Science Foundation Materials Research Science and Engineering Centers (NSF-MRSEC)
• Nippon Telegraph and Telephone Corporation (NTT Group, Japan)
• Pirelli  S.p.A.
• Shin Etsu

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